KUKA is presenting its mobile robotic wafer-handling system for human/machine collaboration at Semicon 2023, which takes place July 8-10 at Moscone Center in San Francisco, CA.
The system allows fab shops to transport 200 mm or 300 mm wafer boxes and SMIF boxes and provides open cassette machine loading and unloading.
The system combines a KUKA LBR iiwa 14 R820 CR robot mounted on one of the company‘s KMP 200 CR automated mobile platforms. Both the robot and mobile platform are cleanroom class ISO 3 rated and feature advanced safety and navigational functionality.
As a seven-axis robot, the LBR iiwa 14 R820 CR handles payloads up to 14 kg and has no external cabling for obstruction-free operation. The mobile platform is outfitted with KUKA’s omnidirectional wheel technology for maximum flexibility and high-precision movement.
The solution is completely integrated with one controller for the robot, platform and navigation as well as one software solution for all three. Safety functions include laser scanning and safety warning/safety stop fields, among others.
The mobile robotic solution was developed in partnership with the world’s largest semiconductor fabricators. It reliably transfers materials in areas unsuitable for traditional automated material handling systems.
KUKA will be in the Moscone Center South Hall at booth #135.